MEMS Sensors Joint effort pairs Chirp’s ultrasonic technology with the Qualcomm® Snapdragon™ Mobile XR (VR/AR) Platform to enable ultra-wide field-of-view, inside-out controller tracking for mobile VR/AR at 1/100 power of other solutions. January 8, 2019 TDK Corporation (TSE: 6762) announced it is working with Qualcomm Technologies, Inc. through its group company, Chirp Microsystems, to make … Continue reading Chirp Microsystems and Qualcomm Technologies, Inc. collaborate to bring inside-out 6-DoF controller tracking to mobile VR/AR headsets