Industry’s Thinnest Form Factor for Smartphones and IoT Devices
SAN JOSE, Calif.–(BUSINESS WIRE)–Jan. 6, 2016– InvenSense, Inc., (NYSE:INVN), a leading provider of MEMS sensor platform solutions, announced its 4th generation of digital 2-axis gyroscopes for Optical Image Stabilization (OIS) in smartphones and drones. InvenSense, the technology market leader and the #1 gyroscope provider to the OIS market, has again set the standard with a family of 2-axis gyroscopes, including the ICG-1020S and ICG-1020P at 2.3×2.3×0.75mm and the ICG-1021S and ICG-1021P at an industry leading 0.5 mm height for a gyroscope. The lower height matches the most popular companion OIS controllers out on the market today, allowing camera module makers to dramatically reduce the module thickness facilitating the continued development of the thinnest smartphones and IoT devices.
The ICG-1020P and ICG-1021P families of InvenSense OIS gyroscopes are the highest performance MEMS sensors in the market with the widest bandwidth and lowest rate noise of 3.5 mdps/√Hz available today. Each of the OIS sensors supports integrated temperature sensors with advanced temperature compensation algorithms that allow low bias drift for long exposure times despite significant heat from the image sensor. The combination of these key parameters enables extended exposure times never before possible in a smartphone camera. Every sensor supports one percent max sensitivity tolerance to cut up to two minutes from OIS module production time without use of shake tables widely used to reduce the large sensitivity error of standard gyroscopes. Both the ICG-1020 and ICG-1021 families further allow efficient manufacturing by supporting ultrasonic wash methods, commonly used post-component mounting to remove solder particles from affecting the image sensor and lens assemblies.
“With image quality being a key differentiator in today’s smartphones and IoT devices, InvenSense continues to pioneer small form factor, high performance gyroscopes dedicated for Optical and Electronic Image Stabilization (EIS),” stated Mehran Ayat, senior director, motion and sound products at InvenSense. “Our performance has awarded us the most OEM wins with the most respected digital SLR camera brands in the market today, and has established InvenSense as the gyroscope of choice for all OIS modules for high end smartphones.”
This ICG-1020 family is in production and expected to ship in smartphones in Q1’16. The 0.5 mm height ICG-1021 gyros are sampling now with production in Q2’16. InvenSense is exhibiting in booth #36217 in South Hall 4 at the 2016 Consumer Electronics Show taking place in Las Vegas, Nevada from January 6 – 9, 2016. To schedule press and partner meetings at the show, contact pr@invensense.com. For additional information and data sheets, please visit www.invensense.tdk.com or contact InvenSense Sales at sales@invensense.com.
About InvenSense
InvenSense, Inc. (NYSE:INVN) is the world’s leading provider of MEMS sensor platforms. The company’s patented InvenSense Fabrication Platform and MotionFusion® technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy. More information can be found at www.invensense.tdk.com or follow us on Twitter at @InvenSense.
©2016 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, FireFly, SensorStudio, TrustedSensor, Coursa, Coursa Sport, UltraPrint, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.
View source version on businesswire.com: http://www.businesswire.com/news/home/20160106005615/en/
Source: InvenSense, Inc.
