InvenSense Enters Distribution Agreements With Two New Partners to Offer IoT Solutions Portfolio Globally

Partnerships to Deliver High Performance, MEMS Sensor SoC Solutions to the IoT and Drone Markets

SAN JOSE, Calif.–(BUSINESS WIRE)–Nov. 17, 2015– InvenSense, Inc. (NYSE:INVN), the leading provider of MEMS sensor platform solutions, today announced multiple strategic distribution agreements, increasing the footprint of InvenSense parts to the globally expanding Internet of Sensors platform. Two new partners specializing in servicing the market for IoT and drone solutions include: Honestar Technologies Co., Ltd, a professional semiconductor distributor and solution provider focused on the IoT market in China and GH Development Holdings Ltd., a company dedicated to professional IC design services and product development based on its “smart” platforms for radio controlled toys, drones and gaming devices.

The partnerships allow both new distributors to offer InvenSense’s complete portfolio of MEMS motion and sound SoC solutions and evaluation boards. Products from InvenSense are now in stock and available for purchase from all two global distributors.

“We keenly understand the importance of diverse hardware and software sensor solutions for IoT businesses,” said Loy Chen, Executive Vice President, Honestar Technologies Co. Ltd. “This global agreement with InvenSense helps further our commitment to providing the newest products and technologies for the world’s design engineers and is synergistic with our existing IoT product lines, serving thousands of customers and developers.”

“After having a long relationship using InvenSense parts in our ‘Smart’ platforms of remote control products, we are thrilled to be signing a distribution agreement with InvenSense, which brings new possibilities to our customer base,” said Tim Zhang, CEO, GH Development Holdings Limited. “Adding InvenSense’s full product line of quality motion and sound parts for the Internet of Things market to GH’s offerings exemplifies our commitment to leverage our scale with customers and capture this fast-growing and emerging opportunity.”

“Adoption of our motion and sound devices is being rapidly designed into everything from toothbrushes to commercial drones by numerous innovative and emerging companies. New product distribution, with very seasoned sales channel partners representing complimentary line card vendors, will provide superior support and far reaching access to the tens of thousands of customers in the IoT and drone markets,” said Daniel Goehl, InvenSense’s Vice President of Worldwide Sales. “With the addition of two key distributors of our products, InvenSense can now provide a better global support structure for our valuable customers and their ever changing design needs.”

For additional information about the InvenSense motion and sound devices, please visit our website at www.invensense.tdk.com or contact InvenSense Sales at sales@invensense.com.

About InvenSense

InvenSense, Inc. (NYSE:INVN) is the world’s leading provider MEMS sensor platforms. The company’s patented InvenSense Fabrication Platform and MotionFusion® technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy. More information can be found at www.invensense.tdk.com or follow us on Twitter at @InvenSense.

©2015 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, FireFly, MotionTracking, Coursa, Coursa Sport, UltraPrint, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.

Source: InvenSense, Inc.