TDK and Qualcomm Technologies drive robotics industry forward with new TDK RoboKit supporting Qualcomm Robotics RB3 Platform and Robot Operating System (ROS)

  • TDK RoboKit includes a 6-axis IMU, pressure sensor, magnetometer, temperature sensor, motor controller, and ultrasonic ToF sensors
  • TDK RoboKit is compatible with the Qualcomm® Robotics RB3 Development Kit


January 7, 2020

TDK Corporation (TSE: 6762) announces RoboKit, a new development kit that enables seamless integration of solutions from TDK’s portfolio designed for the robotics market. RoboKit integrates key TDK offerings such as InvenSense ICM-42688-P 6-axis IMU, InvenSense ICP-10111 capacitive barometric pressure sensor, InvenSense ICS-43434 multi-mode digital microphone, Chirp CH-101 and CH-201 ultrasonic ToF sensors, and Micronas motor controller, angle sensor, and position sensors.

The robotics market is one of the seven key market segments of TDK, with a dominant footprint in typical robotic systems such as sensors, controllers, batteries, and components.  TDK delivers solutions that meet the rigorous demands of the robotics market, such as heading accuracy of under 10 degrees per hour using InvenSense IMUs and RoboVac software, market-ready inertial navigation system (INS) from Coursa Drive, robust obstacle detection for any color objects in all lighting conditions using Chirp ultrasonic ToF sensor, in addition to robot joint control using Micronas motor controllers. Also included are a temperature sensor and magnetometer.

Additionally, the TDK RoboKit software integrates with the leading robotic operating system, ROS. ROS-ready drivers for IMU and ultrasonic range sensor are available now.

TDK and Qualcomm Technologies also announce the compatibility of TDK RoboKit with the Qualcomm® Robotics RB3 platform. Fundamental to every type of robot are three operations: sensing, thinking, and acting. With TDK providing the “sensing” and “acting” operations through its extensive portfolio of sensors and software, and Qualcomm Technologies enabling the “thinking” operation through the power and performance of the Qualcomm® SDA845 processor, the TDK RoboKit platform offers seamless integration for development and support across multiple robotics applications.

“Together, Qualcomm Technologies and TDK continue to drive cutting edge innovation and ever-greater performance for the robotics industry,” said Dev Singh, Senior Director, Business Development and Head of Robotics, Qualcomm Technologies, Inc. “We have seen tremendous success with the release of the Qualcomm Robotics RB3 platform, and look forward to many more collaborations with TDK in this space.”

“With the RoboKit, the developer community can focus on building robots for specific use cases,” said Rahul Bakshi, Senior Director Software Engineering, InvenSense, Inc, A TDK Group Company . “The Qualcomm Robotics RB3 platform in combination with our TDK RobotKit can provide developers with TDK’s best-in-class sensor hardware and fusion algorithms along with the Qualcomm® Artificial Intelligence Engine for delivering unparalleled performance in critical functions in robotic systems, such as object detection, crash avoidance, and navigation.”

“We’re happy to see TDK work to officially support the RoboKit with The Robot Operating System,” said Brian Gerkey, CEO, Open Robotics. “This focus will help make it easier for the ROS community to leverage this technology and expand their capabilities.”

The TDK RoboKit is available to select early partners and customers. General availability is expected in second half of 2020.

TDK will demonstrate the TDK RoboKit and representative use cases such as flooring type detection for robotic vacuum cleaner, along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries, at CES 2020, booth #11448 in Central Hall, Las Vegas Convention Center, January 7-10, 2020 in Las Vegas. For more information, please visit or send queries to


  • 6-Axis: 3-Axis Gyroscope + 3-Axis Accelerometer
  • IMU: Inertial Measuring Unit
  • Pressure Sensor: Capacitive barometric measuring device
  • ToF: Time of Flight
  • MEMS: Micro Electrical Mechanical Systems
  • CV: Computer Vision

Main applications

  • Industrial Robotics
  • Consumer Robotics
  • Drones

Key features and benefits:

  • Ultra-low noise and exceptional relative accuracy
  • Ultra-low power
  • Best gyroscope temperature stability
  • Ultrasonic-based obstacle detection regardless of object color, materials, and ambient lighting conditions and without privacy or safety concerns
  • Cost-effective near-range sensing covering the blind zones of CV or lidar based solutions

About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, Chirp, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2019, TDK posted total sales of USD 12.5 billion and employed about 105,000 people worldwide.

About InvenSense

InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK.  InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to

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Qualcomm, is a trademark of Qualcomm Incorporated, registered in the United States and other countries.

 Qualcomm Robotics Platform, Qualcomm SDA845, and Qualcomm Artificial Intelligence Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries.