TDK announces world’s first MIPI standard SoundWire® microphone
T5808 is a 66 dB SNR/135dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package
Supports up to seven individually configurable microphones on a single audio bus
SoundWire 1.1 compliant based on Mobile Industry Processor Interface (MIPI) Alliance open standards
January 8, 2020
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.
The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM). The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can seamlessly transition back and forth without audio glitches.
The SoundWire Standards Committee, who created the MIPI standard for SoundWire, includes technology leaders in application processors, audio DSPs and codecs, and other ICs. SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire revolutionizes how audio devices and ICs communicate by integrating audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.
“As a member of the SoundWire Standards Committee, Qualcomm Technologies has supported the SoundWire interface on speaker amplifier producs for a number of years. We are excited to see TDK’s microphone technology now incorporating this interface,” says Rahul Shinkre, Director, Product Management at Qualcomm Technologies, Inc.
TDK will be demonstrating the T5808 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, January 7-10, 2020 in Las Vegas, Nevada. T5808 is currently in mass production and will be available through distribution in Q1 2020. For samples and additional information, please contact firstname.lastname@example.org or visit www.invensense.tdk.com/products/digital/t5808/
HQM: High Quality Mode
LPM: Low Power Mode
CCM: Concurrent Mode
AOP: Acoustic Overload Point
Security and Surveillance
5 × 2.65 × 0.98 mm surface‐mount package
Low power: 215 µA in Low‐Power Mode
Extended frequency response from 40 Hz to >20 kHz
Sleep Mode: 10 µA
High power supply rejection (PSR): −91 dB FS
Fourth‐order Σ‐Δ modulator
Digital pulse density modulation (PDM) output
Compatible with Sn/Pb and Pb‐free solder processes
Packaging Dimensions (mm)
3.50 × 2.65 × 0.98
Acoutsic Overload Point dB SPL
Low Power Mode µA
Low Frequency Corner Hz
About TDK Corporation
TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, Chirp, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2019, TDK posted total sales of USD 12.5 billion and employed about 105,000 people worldwide.
InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to www.invensense.com.