TDK’s David Horsley elevated as a 2022 IEEE Fellow

  • Dr. David Horsley was elected as a 2022 IEEE Fellow, honoring his development of micro-electromechanical systems for ultrasonic transduction

February 3, 2022

TDK Corporation (TSE:6762) announced today that Dr. David Horsley has been elected a 2022 Institute of Electrical and Electronics Engineers (IEEE) Fellow.

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Dr. David Horsley is a co-founder and Chief Technology Officer (CTO) of Chirp Microsystems, which is now part of InvenSense, a TDK Group Company. He has also served as a professor of Mechanical and Aerospace Engineering at UC Davis since 2003, after earning a B.S. degree, an M.S. degree, and a Ph.D. degree in Mechanical Engineering, all at UC Berkeley. Dr. Horsley has 21 issued and licensed U.S. patents and 11 pending patent applications. He has also recently been named as an inductee into the 2021 MEMS and Sensors Industry Group (MSIG) Hall of Fame, and is a Fellow of the National Academy of Inventors since 2020.

“I’m really honored to be elevated to IEEE Fellow. I was named Fellow for ‘development of micro-electromechanical systems for ultrasonic transduction’, so clearly Chirp and the whole Chirp team were a big part of why I received this honor,” said Dr. Horsley. “It has been really rewarding to see MEMS move into the mainstream over the last 25 years and I’m glad that I was able to play a part in moving this technology out of the lab and into people’s homes. I’m also happy to see how many of my former students and post-docs are making important contributions in the MEMS industry.”

The grade of IEEE Fellow is one of the highest honors given by the institute. This eminent Fellow Program is designed to recognize and honor extraordinary achievements and significant contributions to society in engineering, science, and technology. The program only selects a few IEEE members annually across the world, pulled from a pool of nominees who are considered “IEEE senior members” or “life senior grade,” and who are in good standing for at least 5 consecutive years.

Dr. David Horsley added, “For people starting in the field today, I think it’s a really exciting time because it’s so much easier to make a MEMS product today than it was 10 years ago. MEMS ultrasonics are finally starting to have the impact that we imagined when I, together with Chirp co-founders Bernhard Boser, Richie Przybyla and Stefon Shelton, made the first MEMS time-of-flight sensor and later, together with Hao-Yen Tang (now at Ultrasense) and Yipeng Lu (now at Qualcomm), made the first MEMS ultrasonic fingerprint sensor.”

About TDK Corporation

TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2021, TDK posted total sales of USD 13.3 billion and employed about 129,000 people worldwide.

About InvenSense

InvenSense, Inc., a TDK Group company, is a world leading provider of performance SmartSensing platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to

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