The InvenSense bottom-ported MEMS microphones are high-performance acoustic transducers featuring an extended wideband frequency response. Although the response of the microphone exhibits very little variation over its operating range, placement of the microphone inside a device case may introduce changes to this response.
This application note provides mounting recommendations for minimizing the influence of packaging on the microphone performance in the final product. Electrical connections, codec interfaces, and performance aspects are described, as well. This application note discusses the following:
- Mechanical design considerations: printed circuit board (PCB) mounting, use of gaskets and spacers, and avoiding resonances
- Electrical connections: analog connections, digital data format, and codec interfaces
- Application-enabling performance aspects