Pavan Gupta joined TDK InvenSense in December 2021 as the Chief Operating Officer (COO). Prior to joining, Pavan served as a Director of Hardware Engineering at Apple. During his 6 years at Apple, Pavan led the development of Touch and Force sensing technologies on several generations of iPhones and Air Pods. Prior to that, Pavan spent 10 years at SiTime, a leader in MEMS timing space, growing into the role of Vice-President of Operations where he oversaw SiTime’s worldwide fabless manufacturing, logistics and planning, product and test engineering, and quality and reliability. Pavan has also worked at other MEMS-based companies including FormFactor and NanoGear, Inc. (formerly C Speed Corp). He started his career at IBM.

Pavan received his MS from Stanford University and BS from UCLA, both in Mechanical Engineering. He holds 19 patents on topics ranging from MEMS, packaging, haptics, and force sensing.

Joan Huser is the Vice President of Worldwide Sales, MEMS BG at TDK. Joan joined InvenSense, a TDK group company in 2016, and prior to her current role, served as Vice President of Americas and EMEA Sales. Prior to joining InvenSense, Joan spent three years at AMS, leading a team in selling analog sensors, wireless, and power management technologies to strategic consumer, computing and communications OEMs, and ecosystem partners throughout the Americas. For nine years at Broadcom Corporation, Joan led worldwide sales of network infrastructure, wireless connectivity, and broadband communications products to become the top semiconductor supplier to Cisco. Prior to Broadcom, Joan served as Vice President of Business Development and Marketing at W-CDMA semiconductor company MorphICs (acquired by Infineon).

Joan began her career designing Digital Signal Processor chips, development tools, and application software at AT&T Bell Labs, before moving to Tokyo, Japan as a DSP-focused marketing manager. Upon her return to the US, she led a nation-wide FAE team supporting AT&T Microelectronics business units / products including wireless baseband and RF technologies, analog modem and digital voice storage, video conferencing, graphics, LAN, mass storage, FPGA, and optoelectronics technologies. Joan then led a nation-wide sales team at Lucent Microelectronics in securing business at strategic Computing OEMs and ODMs, customer premise equipment manufacturers, networking, and remote access server developers.

Joan holds Bachelor of Science degrees in Computer Science and Electrical Engineering from Washington University in St. Louis and a Master of Science degree in Electrical Engineering from Stanford University.

Fabio Pasolini is the Vice President and General Manager of the Emerging Sensors Business Unit at TDK InvenSense. Prior to this role Fabio drove Business Development, Ecosystem Development, and Consumer Motion Marketing for InvenSense. Fabio has 25 years of working experience in the MEMS field and prior to joining TDK, began his career at STMicroelectronics (ST) where he contributed to the company’s earliest efforts of MEMS activities. At ST, Fabio held multiple disciplinary roles, including the development of several integrated circuits as Analog and Digital IC Designer, Marketing and Business Development, cumulating into the role of General Manager for the MEMS Product Division a multi-hundreds million dollar business unit at STMicroelectronics.

Fabio holds a Master’s Degree (summa cum laude) in Computer Engineering with specialization in Microelectronics from the University of Pavia, Italy and has been granted 30 patents in the field of stabilization techniques for band-pass sigma-delta converters, low-power readout interfaces, and applications for MEMS based sensors.