Unparalleled Efficiencies Allow Elegant Industrial Designs
SAN JOSE, Calif.–(BUSINESS WIRE)–Feb. 22, 2016– InvenSense Inc. (NYSE:INVN), a leading provider of MEMS sensor platform solutions, announces the availability of the ICS-43434 providing the most efficient audio path for space constrained wearables and Internet of Things (IoT) devices. InvenSense’s new ICS-43434 I2S microphone provides 65% power savings in its low power mode compared to existing solutions while delivering excellent acoustic performance targeted to IoT and Wearable application.
Providing a direct digital I2S interface to the main application processor, the ICS-43434 eliminates the need for the CODEC in smartphones commonly used with analog microphones. This approach saves area and reduces power consumption, especially critical to a wearable design where small board space and small battery are important to enabling a small form factor. The ICS-43434 acoustical properties have also been optimized for wearable and IoT applications where high sensitivity is needed to listen for user’s command as the main means of communication in a low power state. The InvenSense ICS-43434 is able to maintain this high acoustic sensitivity while at the same time it avoids acoustical distortion or voice that can happen when the user brings a wearable device close to for a voice command in a noisy environment such as concert. This combination of system efficiency along with targeted-acoustical properties result in industrial designs that are functional and elegant at the same time.
“InvenSense continues to be committed to introducing disruptive, high performance and innovative Audio solutions into the market,” said Eitan Medina vice president marketing and product management, InvenSense. “The new ICS-43434 provides the most flexible and efficient system design, enabling our OEM partners to create a differentiated audio experience where audio is the main means of communication with the device.”
The ICS-43434 is sampling now with MP quantities available in Q2 2016.
InvenSense is exhibiting in Hall2 stand 2C16MR at the 2016 Mobile World Congress taking place in Barcelona, Spain from February 22 – 25, 2016. To schedule press and partner meetings at the show, contact firstname.lastname@example.org. For additional information and data sheets, please visit www.invensense.tdk.com or contact InvenSense Sales at email@example.com.
InvenSense, Inc. (NYSE:INVN) is the world’s leading provider of MEMS sensor platforms. The company’s patented InvenSense Fabrication Platform,MotionFusion® technology, and location software and services address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy. More information can be found at www.invensense.tdk.com, follow us on Twitter at @InvenSense.
©2016 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, FireFly, SensorStudio, TrustedSensor, Coursa, Coursa Sports, Coursa Retail, UltraPrint, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.
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Source: InvenSense Inc.