SAN JOSE, Calif.--(BUSINESS WIRE)--Oct. 28, 2015-- InvenSense, Inc. (NYSE:INVN), the leading provider of MEMS sensor platforms, today announced it has released for OEM review UltraPrint^™, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP), offering ramp to production in calendar year 2017. As the world’s largest fabless MEMS SOC innovator and source for the eutectically bonded ICMP, InvenSense ships, on average, over twelve million motion or audio sensor SOCs each week to leading global mobile and IoT OEMs.

By adding aluminum nitride-based piezoelectric capacity to its platform, InvenSense is enabling, for the first time, mass manufacture of unique piezoelectric Micromachined Ultrasonic Transducers (pMUT) and transducer arrays, with each transducer element individually controllable through direct wafer-level interconnect to the CMOS ASIC.

This dramatic advancement in acoustic imaging technology will allow manufacturers to seamlessly integrate, on a platform proven capable of accommodating exceptionally high volumes, detailed fingerprint images from the epidermal to dermal layers, and to do so directly through glass or metal, even in the presence of oil, lotions, perspiration or other moisture, and other common contaminants that can easily undermine legacy capacitive solutions. These critical factors enhance live finger authentication and guard against spoofing, thereby increasing security.

Fari Assaderaghi, InvenSense’s Vice President Advanced Technology, commented: “Our proprietary UltraPrint technology is expected to enable, for the first time, deployment of ultrasonic fingerprint solutions under glass, as well as a myriad of other surfaces. This flexibility in sensor placement without cutting a hole in display glass, aluminum, steel or plastic case material is highly valued by mobile and other OEMs. Our innovative team is excited to work with equally motivated partners to quickly bring this new technology to market.”

Mo Maghsoudnia, InvenSense’s Vice President Worldwide Manufacturing, added: “As a leading innovator in MEMS and sensor technology globally, and the world’s only fabless MEMS SOC vendor selling hundreds of millions of motion and audio sensors each year, we have a proven track record of rapidly ramping up innovative new MEMS solutions into mass production. We’re excited to extend the InvenSense CMOS-MEMS Platform to pMUT devices and enable a breakthrough authentication solution for leading mobile and IoT products.”

For additional information about UltraPrint™ ultrasonic fingerprint imaging solution, please contact InvenSense Marketing at marketing@invensense.com.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, including statements regarding the features and benefits of InvenSense’s products and the anticipated impact of its new products to advance acoustic imaging technology and deployment of ultrasonic fingerprint solutions on a global scale. Actual results may vary materially due to a number of factors including, but not limited to, the risk that InvenSense’s products do not operate as intended or do not receive market acceptance, the loss of a key customer, claims of technology infringement, general economic conditions and other risks detailed from time to time in InvenSense’s Quarterly Report on Form 10-Q for the quarter ended June 28, 2015 and other SEC reports, which can be found at www.sec.gov. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. InvenSense undertakes no obligation to publicly release or otherwise disclose the result of any revision to these forward-looking statements that may be made as a result of events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.

About InvenSense

InvenSense, Inc. (NYSE:INVN) is the world’s leading provider of MEMS sensor platforms. The company’s patented InvenSense Fabrication Platform and MotionFusion^® technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy. More information can be found at www.invensense.tdk.com or follow us on Twitter at @InvenSense.

©2015 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, UltraPrint, FireFly, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.

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Source: InvenSense, Inc.