• High-performance microphone offering 138dB SPL AOP
• Enabling clear audio capture in loud and noisy conditions
• Extended frequency response from 35 Hz to 20kHz

August 5, 2020

TDK Corporation introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package. The analog MEMS microphone is equipped with high dynamic range, operates up to 105°C, and is designed for IoT and consumer devices.

The new ICS-40638 microphone is ideal for wearable and IoT applications, particularly in outdoor, industrial or harsh environments, where high temperature and high acoustic overload points present system design challenges. The ICS-40638 includes a MEMS microphone element, an impedance converter, and a differential output amplifier. Other high‐performance specifications include a tight ±1 dB sensitivity tolerance and enhanced immunity to both radiated and conducted RF interference. The part is ideal for noise cancelling applications in challenging environments.

“TDK has a strong presence in the wearable and IoT market segments and our full-line of MEMS microphones makes us the ideal partner to solve our customers’ audio challenges,” said Kieran Harney, Managing Director, Audio Products, InvenSense, a TDK group company. "The ICS-40638 with its ultra-high AOP and high temperature operation enables our partners to design acoustic listening systems that stand up to the loudest and noisiest environmental surroundings."

The InvenSense ICS-40638 part and the ICS-40638 evaluation board (EVB) are now available from multiple distributors worldwide. For additional information and collateral, please visit https://invensense.tdk.com/products/analog/ics-40638/ or contact InvenSense Sales at sales@invensense.com.

Glossary

• MEMS: Micro-Electrical Mechanical System
• AOP: Acoustic Overload Point
• SPL: Sound Pressure Level
• SNR: Signal to Noise Ratio
• IoT: Internet of Things
• OEM: Original Equipment Manufacturing

Main applications

• Wearables
• IoT devices
• Automotive
• Still/Video Cameras

Key features

• 5 mm x 2.65 mm x 0.98 mm package bottom port surface‐mount package
• 138 dB AOP SBL
• 63 dB SNR
• Differential analog output
• −43 dBV sensitivity (differential)
• ±1 dB sensitivity tolerance
• Extended frequency response from 35 Hz to 20 kHz
• Enhanced RF immunity
• −81 dB PSRR
• Compatible with Sn/Pb and Pb‐free solder processes
• RoHS/WEEE compliant

Key data

About TDK Corporation

TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2020, TDK posted total sales of USD 12.5 billion and employed about 107,000 people worldwide.

About InvenSense

InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK.  InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to invensense.tdk.com

Further information on the products can be found under https://invensense.tdk.com/technology/sound/