• SmartSonic™ ICU-30201 provides highly accurate obstacle avoidance and proximity/presence detection for smart homes, smart buildings, robotics, drones, cameras, and more
• The MEMS ultrasonic time-of-flight sensor provides accurate range measurements at distances up to 9.5m over a wide and configurable field-of-view, on any surface and under any lighting condition
• With a powerful embedded processor, the ICU-30201 sensor can detect human presence on-chip, enabling low-power wakeup with power consumption of less than 0.5mW

January 6, 2025

TDK Corporation (TSE: 6762) announces the start of full-scale production of its InvenSense SmartSonic™ ICU-30201 ultrasonic time-of-flight (ToF) sensor. The ICU-30201 enhances the contextual awareness of products that require accurate presence, proximity, and distance measurements, such as robotics, drones, alarm devices, door locks, camera devices, smart building systems, and more. Mass production began this month, in January 2025.

The extended maximum range of ICU-30201 enables room-scale presence sensing and long-range obstacle detection, which enables a new class of smart home and smart building devices. It is the latest release in the SmartSonic™ sensor family to embed a more powerful on-chip processor with higher computational power. TDK offers a number of algorithms, including rangefinding and presence-sensing, which run on-chip, offloading the system MCU and saving power, while customers can also write their own algorithms for the sensor. The new bottom port package solution allows easy mechanical integration.

“ICU-30201 represents the culmination of a vision that MEMS ultrasonic time-of-flight is the perfect technology for room-scale true presence sensing," said Richard Przybyla, senior director of engineering at InvenSense, a TDK group company. "With its enhanced maximum range, low power consumption, and the on-chip processing power to detect minor motions of a human, product designers finally have an option that beats PIR on performance while remaining on a battery-friendly power budget.”

The ICU-30201 integrates a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (system on chip) in a miniature reflowable package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides highly accurate and robust range measurements to targets at distances up to 9.5m, in any lighting condition, including full sunlight and independently of the target’s color and optical transparency.

InvenSense’s ultrasonic time-of-flight sensors will be demonstrated by accessibility technology company WeWALK during CES 2025, at the TDK booth #15815 in Las Vegas, January 7-10. Also announced today, WeWALK’s AI-powered Smart Cane 2 uses TDK sensors including the ultrasonic ToF to enable unlimited mobility for visually impaired people.

The ICU-30201, in an ultra-compact package footprint of 5.17 x 2.68 x 0.9 mm3, is now available from multiple distributors worldwide. For additional information or to request a sample, please visit https://invensense.tdk.com/smartsonic or contact InvenSense Sales at inv.sales.us@tdk.com.

Glossary

• ToF: Time of flight
• FoV: Field of view
• EV: Evaluation module
• DK: Developer kit
• MEMS: Micro-electro-mechanical systems
• PIR: passive infra-red

Main Applications

• Occupancy/presence detection for smart building applications
• Obstacle avoidance for robotics and drones
• Presence detection and ranging for smart thermostat

Main Applications

• Second generation
• Ultra-low power
• Compact size; miniature ultrasonic sensor
• Wide operating range from 30 cm to 9.5 m
• Works in any lighting condition
• Detects objects of any color and optical transparency
• Customizable field of view (FoV) up to 180°
• Bottom port package for easier mechanical integration
• 5.17 mm x 2.68 mm x 0.9 mm, 13-pin LGA package

About TDK Corporation

TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2024, TDK posted total sales of USD 14.6 billion and employed about 101,000 people worldwide.

About InvenSense

InvenSense, a TDK Group company, is a world-leading provider of Sensing Solutions. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to invensense.tdk.com.

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