TDK enhances scalability of its SmartAutomotive™ performance platforms with newly expanded IMU portfolio

  • IAM-20680HT high temperature automotive 6-Axis MotionTracking™ device for non-safety automotive applications
  • Extends standard IAM-20680 performance up to 105°C
  • Two independent interrupt lines and extended FIFO up to 4096-bytes
  • Automotive qualification based on AEC-Q100 grade 2 (operating range -40°C to 105°C)
  • Pin-to-pin and register compatible with IAM-20680, IAM-20680HP, IAM-20380, IAM-20381

December 07, 2021

TDK Corporation (TSE: 6762) announces today the availability of InvenSense IAM-20680HT high temperature automotive monolithic 6-Axis MotionTracking sensor platform solution for non-safety automotive applications, which includes the IAM-20680HT IMU MEMS sensor and the DK-20680HT developer kit.

The IAM-20680HT embeds a 3-axis gyroscope and a 3-axis accelerometer in a thin 3 x 3 x 0.75mm (16-pin LGA) package and is automotive qualified based on AEC-Q100 Grade 2. It also features two programmable independent interrupt lines and wake-on-motion feature for low power operation of applications processor. The solution also boasts a FIFO up to 4096-bytes that can lower the traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode.

“The InvenSense IAM-20680HT combines the IAM-20680 level of performance with the IAM-20680HP extended temperature range, offering the market the best trade-off in term of costs and benefits,” said Alberto Marinoni, Director Product Marketing Automotive at InvenSense, a TDK Group company. “Thanks to the new IAM-20680HT, mid-end automotive solutions can benefit of reliable inertial data up to 105°C keeping the right level of performance under all the operating conditions.”

More than ever, emerging automotive non-safety applications require a high level of computational power that generates significant self-heating of the printed circuit board with a consequent thermal impact on all the electronic components. With a maximum operating temperature of 105°C and its negligible power dissipation, the IAM-20680HT is well-suited for such applications.

IAM-20680HT provides best-in-class low noise performance, on-chip 16-bit ADCs, and industry-leading sensitivity tolerance. These fundamental features are important towards the enhancement of positioning systems’ accuracy, enabling advanced telematic features and triggering emergency calls in a timely manner.

The InvenSense IAM-20680HT automotive IMU is available from multiple distributors worldwide and is part of a fully compatible, multi-axis, multi-grade IMU portfolio of SmartAutomotive products reinforcing InvenSense’s undisputed leadership in the 6-axis IMU market for both safety and non-safety automotive applications. For additional information and collateral, please visit invensense.tdk.com/smartautomotive or contact InvenSense Sales at sales.us@invensense.com.

Glossary

  • 6-axis: 3-Axis Gyroscope + 3-Axis Accelerometer
  • MEMS: Micro-Electro-Mechanical Systems
  • DK: Developer Kit
  • LGA: Land Grid Array
  • FIFO: First in First out

Main applications

IAM-20680HT addresses a wide range of automotive applications, including but not limited to:

  • Navigation systems Aids for Dead Reckoning
  • Telematics
  • Insurance Vehicle Tracking
  • Accurate Location for Vehicle to Vehicle and Infrastructure
  • Head-up display (HUD) and augmented reality HUD
  • Car alarm

Features

  • Automotive-qualified based on AEC Q100 Grade 2
  • 16-bit digital-output for both Gyroscope and Accelerometer
  • Gyroscope: X-, Y-, and Z-axis angular rate sensors with a user-programmable full-scale range of ±250dps, ±500dps, ±1000dps, ±2000dps
  • Accelerometer: X-, Y-, and Z-axis accelerometer with a programmable full-scale range of ±2g, ±4g, ±8g, ±16g
  • User-programmable digital filters for gyroscope, accelerometer, and temperature sensor
  • Embedded Self-test
  • Two embedded and configurable interrupt lines
  • Reliability testing performed according to AEC–Q100: PPAP and qualification data available upon request
  • Final test at -40 °C, 25 °C, and 105 °C

Key Data

ProductPackage Size
(mm)
Gyro Full Scale Range
(dps)
Gyro Sensitivity
(LSB/°/sec)
Gyro Rate Noise
(mdps/rtHz)
Accel Full Scale Range
(g)
Accel Sensitivity
(LSB/g)
Digital Output
 
Logic Supply Voltage
(V)
Operating Voltage
(V)

IAM‑20680HT
3 × 3 × 0.75±250
±500
±1000
±2000
131
65.5
32.8
16.4
0.005±2
±4
±8
±16
16384
8192
4096
2048
I²C or SPIVDD1.71 – 3.6

DK‑20680HT
SmartAutomotive™ Development Kit for IAM-20680HT Automotive Sensor


About TDK Corporation

TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2021, TDK posted total sales of USD 13.3 billion and employed about 129,000 people worldwide.

About InvenSense

InvenSense, Inc., a TDK Group company, is a world leading provider of high performance MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to invensense.tdk.com


For additional information on the ICP-20100 platform:

You can download this text and associated images at invensense.tdk.com/news-media/tdk-enhances-scalability-its-smartautomotive-performance-platforms-with-newly-expanded-IMU-porfolio/

Further information on the products can be found under invensense.tdk.com/smartautomotive

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