January 11, 2021
TDK Corporation (TSE: 6762) introduces the InvenSense T5838, the latest technology breakthrough in the SmartSound™ product family. The T5838 is the world’s lowest power Pulse Density Modulation (PDM), multi-mode MEMS microphone with high AOP and high SNR for smartphones, microphone arrays, smart speakers, IoT and other consumer devices. The microphone offers an exceptionally efficient 130 µA ultra-low power mode to support ‘AlwaysOn’ applications. The T5838 has outstanding low current of 330 µA in ‘High Quality Mode,’ supporting high fidelity audio with 68 dB SNR and 133 dB AOP at 20kHz bandwidth in a 3.5 x 2.65 x 0.98 mm package.
Smartphones and IoT devices continue to drive the requirement for lower-power ‘AlwaysOn’ sensors. To meet these needs, the T5838 adds Acoustic Activity Detect (AAD) capability, in addition to world leading low power and wide dynamic range, all in an industry-standard footprint.
Acoustic Activity Detect is a new ultra-low power edge processing feature where the microphone monitors the acoustic environment and wakes up the SoC or application processor when activity is detected. It is available with three modes of operation starting at just 20 µA total current draw from the microphone. It provides user programmability to apply various filters and thresholds for optimized performance for each application. It also supports 8kHz bandwidth output for ‘AlwaysOn’ systems requiring audio buffering for cloud processing.
“T5838 introduces groundbreaking power levels, leading acoustic performance and Acoustic Activity Detect in a single PDM microphone,” said Kieran Harney, Managing Director – Audio Products at InvenSense, a TDK Group company. “With the T5838’s latest technology breakthroughs, complementing our SmartSound portfolio of microphones, TDK continues to lead the industry and bring innovative human-sensing to the market.”
T5838 samples are available now, volume production expected in 1H 2021. TDK will be demonstrating the T5838 platform along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries during the upcoming CES 2021 conference, being held digitally at https://www.ces.tech. For additional information and collateral, please visit https://invensense.tdk.com/products/T5838 or contact InvenSense Sales at sales@invensense.com.
Glossary
Main applications
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Key data
Product | Packaging Dimensions (mm) | SNR dBA | Acoustic Overload Point dB SPL | Low Power Mode µA | Bandwidth kHz | Low Frequency Corner Hz | Digital Interface |
T5838 | 3.50 × 2.65 × 0.98 | 68 | 133 | 130 | 20 | 35 | PDM |
About TDK Corporation
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2020, TDK posted total sales of USD 12.5 billion and employed about 107,000 people worldwide.
About InvenSense
InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to invensense.tdk.com
Further information on the products can be found under https://invensense.tdk.com/technology/smartsound/