Our technology includes five core elements:

• Patented InvenSense-Fabrication process,
• Advanced MEMS motion sensor designs,
• Mixed-signal circuitry for sensor signal processing,
• MotionFusion™ and calibration firmware, and
• MotionApps™ software consisting of drivers and APIs for applications development on all major consumer electronics operating systems.

Our patented InvenSense-Fabrication process enables direct integration of MEMS mechanical structures with standard complementary metal oxide semiconductor (CMOS) at the wafer level. This results in significant performance, reliability, integration and cost benefits, and enabled InvenSense to pioneer the industry’s first high-volume, commercial MEMS fabless business model.

Our mixed-signal circuitry provides sensor signal processing which enables MotionFusion™ technology critical to our MotionProcessing™ platform.