This document provides information and general guidelines for handling and assembling boards with CH101 and CH201 ultrasonic transceivers. The goal of the processes outlined herein is to prevent damage of ultrasonic transceivers due to mechanical, vacuum and thermal stress caused by the handling process. Any deviation from the recommendations contained in this Application Note should be reviewed by Chirp Microsystems and thoroughly verified prior to implementation in a production environment.
Version 1.0
