Our technology includes five core elements:
Our patented InvenSense-Fabrication process enables direct integration of MEMS mechanical structures with standard complementary metal oxide semiconductor (CMOS) at the wafer level. This results in significant performance, reliability, integration and cost benefits, and enabled InvenSense to pioneer the industry’s first high-volume, commercial MEMS fabless business model.
Our mixed-signal circuitry provides sensor signal processing which enables MotionFusion™ technology critical to our MotionProcessing™ platform.
Highly integrated and cost effective solutions enabled by our patented InvenSense-Fabrication Proce Highly integrated and cost effective solutions enabled by our patented InvenSense-Fabrication Proce Highly integrated and cost effective solutions enabled by our patented InvenSense-Fabrication Proce Highly integrated and cost effective solutions enabled by our patented InvenSense-Fabrication Process
Manufacturing efficiency, flexibility and scalability Manufacturing efficiency, flexibility and scalability Manufacturing efficiency, flexibility and scalability Manufacturing efficiency, flexibility and scalability Manufacturing efficiency, flexibility and scalability
Scalable MotionProcessing™ platform with opportunities for multi-sensor integration Scalable MotionProcessing™ platform with opportunities for multi-sensor integration Scalable MotionProcessing™ platform with opportunities for multi-sensor integration Scalable MotionProcessing™ platform with opportunities for multi-sensor integration
High performance and reliability High performance and reliability High performance and reliability High performance and reliability High performance and reliability
