Chirp’s MEMS ultrasonic technology leverages a proprietary Time-of-Flight (ToF) range sensor in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor handles a variety of ultrasonic signal-processing functions, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, object-detection/avoidance, and position-tracking.
Complementing Chirp’s other ultrasonic ToF sensor products, the CH101 provides accurate range measurements to targets at distances up to 1.2m. Using ultrasonic pulse-echo measurements, the sensor works in any lighting conditions, including full sunlight, and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s wide Field-of-View (FoV) enables simultaneous range measurements to multiple objects in the FoV.
AN-000154 – CH101 Example Driver Hands On
AN-000155 – SonicLink Software Quick Start Guide
AN-000157 – Chirp Microsystems CH101 SmartSonic Evaluation Kit Users Guide
AN-000158 – CH101 Mechanical Integration Guide
AN-000159 – CH101 and CH201 Ultrasonic Transceiver Handling and Assembly Guidelines
AN-000169 – Ultrasonic Module Pulse-Echo Test Procedure
AH-10133-045045MR STEP file
