Omar Abed

CEO of InvenSense, Inc. and General Manager of TDK Corporation’s MEMS Sensors Business Group

Omar Abed joined TDK in November 2020 as the General Manager & Vice President of the Microphone Business Unit. Before joining, he served as General Manager & Vice President for TE Connectivity driving profitable growth for its $300M pressure sensor business. Previously, Omar served as President & CEO for 7 years at Silicon Microstructures (SMI), which was acquired by TE. While at SMI, he led the turnaround of the company by revamping its strategy and driving innovation to become a leading pressure sensor supplier.

Omar was also part of Analog Devices’ Automotive Inertial MEMS team overseeing development and strategy for the passive safety portfolio. Prior, he worked as Design Engineering Lead at Kavlico Corporation developing ultra-low power capacitive pressure sensors.

Omar received a Bachelor of Science degree in Electrical Engineering and Computer Science from UC Berkeley and a Master of Science in Electrical Engineering with an emphasis on Analog and RF Circuit design from University of Southern California. He is an Alumni of Harvard Business School via the PLD program and holds 5 patents for his work on MEMS pressure sensors.

Joseph Bousaba

Chief Business Officer

Joseph Bousaba is the Chief Business Officer and General Manager for TDK InvenSense overseeing and managing all Business Units. He is responsible for driving product strategy, R&D and execution to deliver on revenue growth and profitability for the company. Prior to this role at TDK InvenSense, Joseph held the positions of General Manager and Vice President of the Motion and Pressure Business Unit and General Manager and Vice President of the Emerging Sensors Business Unit. He also served as President of TDK Chirp Microsystems before integrating it into TDK InvenSense.

Prior to joining TDK in November of 2019, Joseph was the Vice President of Consumer IoT and Smart Home at Qualcomm where he built and managed a multi-hundred million dollar business from 2014 to 2019. Prior to that from 2012 to 2014, Joseph led the Emerging Business unit and the company’s strategy office at Qualcomm Atheros, where he started and built the IoT and automotive wireless connectivity businesses and managed the company’s strategic marketing activity. From 2005 to 2012, Joseph served in multiple product marketing and business development leadership roles at Atheros kickstarting the company’s mobile and consumer connectivity business and serving in strategic and planning roles that contributed to the acquisition of Atheros by Qualcomm. Prior to that, Joseph held multiple engineering and business leadership roles in cellular RF and wireless connectivity at Philips Semiconductors (currently NXP).

Joseph received a M.S. and B.S. degrees in Electrical Engineering from the University of North Carolina at Charlotte.

Pavan Gupta

Chief Operating Officer

Pavan Gupta joined TDK InvenSense in December 2021 as the Chief Operating Officer (COO). Prior to joining, Pavan served as a Director of Hardware Engineering at Apple. During his 6 years at Apple, Pavan led the development of Touch and Force sensing technologies on several generations of iPhones and Air Pods. Prior to that, Pavan spent 10 years at SiTime, a leader in MEMS timing space, growing into the role of Vice-President of Operations where he oversaw SiTime’s worldwide fabless manufacturing, logistics and planning, product and test engineering, and quality and reliability. Pavan has also worked at other MEMS-based companies including FormFactor and NanoGear, Inc. (formerly C Speed Corp). He started his career at IBM.

Pavan received his MS from Stanford University and BS from UCLA, both in Mechanical Engineering. He holds 19 patents on topics ranging from MEMS, packaging, haptics, and force sensing.

Joan Huser

Vice President, Worldwide Sales

Joan Huser is the Vice President of Worldwide Sales, MEMS BG at TDK. Joan joined InvenSense, a TDK group company in 2016, and prior to her current role, served as Vice President of Americas and EMEA Sales. Prior to joining InvenSense, Joan spent three years at AMS, leading a team in selling analog sensors, wireless, and power management technologies to strategic consumer, computing and communications OEMs, and ecosystem partners throughout the Americas. For nine years at Broadcom Corporation, Joan led worldwide sales of network infrastructure, wireless connectivity, and broadband communications products to become the top semiconductor supplier to Cisco. Prior to Broadcom, Joan served as Vice President of Business Development and Marketing at W-CDMA semiconductor company MorphICs (acquired by Infineon).

Joan began her career designing Digital Signal Processor chips, development tools, and application software at AT&T Bell Labs, before moving to Tokyo, Japan as a DSP-focused marketing manager. Upon her return to the US, she led a nation-wide FAE team supporting AT&T Microelectronics business units / products including wireless baseband and RF technologies, analog modem and digital voice storage, video conferencing, graphics, LAN, mass storage, FPGA, and optoelectronics technologies. Joan then led a nation-wide sales team at Lucent Microelectronics in securing business at strategic Computing OEMs and ODMs, customer premise equipment manufacturers, networking, and remote access server developers.

Joan holds Bachelor of Science degrees in Computer Science and Electrical Engineering from Washington University in St. Louis and a Master of Science degree in Electrical Engineering from Stanford University.

Fabio Pasolini

GM & VP – Emerging Sensors Business Unit

Fabio Pasolini is the Vice President and General Manager of the Emerging Sensors Business Unit at TDK InvenSense. Prior to this role Fabio drove Business Development, Ecosystem Development, and Consumer Motion Marketing for InvenSense. Fabio has 25 years of working experience in the MEMS field and prior to joining TDK, began his career at STMicroelectronics (ST) where he contributed to the company’s earliest efforts of MEMS activities. At ST, Fabio held multiple disciplinary roles, including the development of several integrated circuits as Analog and Digital IC Designer, Marketing and Business Development, cumulating into the role of General Manager for the MEMS Product Division a multi-hundreds million dollar business unit at STMicroelectronics.

Fabio holds a Master’s Degree (summa cum laude) in Computer Engineering with specialization in Microelectronics from the University of Pavia, Italy and has been granted 30 patents in the field of stabilization techniques for band-pass sigma-delta converters, low-power readout interfaces, and applications for MEMS based sensors.