Hiro Hayashi is the General Manager and Vice President of the Microphone Business Unit since April 2017, as part of the TDK team, he was located in Dongguan, China, within the assembly and test facility until his recent transfer to silicon valley headquarters in San Jose, California. Prior to that role, Hayashi-san headed the Radio Frequency Module Business Unit at TDK from 2014 to 2017 leading Operations, Product Development and Program Management. Earlier, he held senior leadership positions in Program Management and Test Engineering for RF module business, WiFi and Bluetooth, and established the foundation for TDK’s RF module technologies, leading its key accounts. Hayashi-san joined TDK Corporation in 1993 as an R&D researcher, facilitating TDK Electronics Ireland, where he assisted in the establishment of the TDK European Design Center as Engineering Manager from 1999 to 2005.
Hayashi-san received a Bachelor of Electronics Engineering degree in Electrical and Electronics Engineering from Yamanashi University in Japan.