Joan Huser is the Vice President of Worldwide Sales, MEMS BG at TDK. Joan joined InvenSense, a TDK group company in 2016, and prior to her current role, served as Vice President of Americas and EMEA Sales. Prior to joining InvenSense, Joan spent three years at AMS, leading a team in selling analog sensors, wireless, and power management technologies to strategic consumer, computing and communications OEMs, and ecosystem partners throughout the Americas. For nine years at Broadcom Corporation, Joan led worldwide sales of network infrastructure, wireless connectivity, and broadband communications products to become the top semiconductor supplier to Cisco. Prior to Broadcom, Joan served as Vice President of Business Development and Marketing at W-CDMA semiconductor company MorphICs (acquired by Infineon).
Joan began her career designing Digital Signal Processor chips, development tools, and application software at AT&T Bell Labs, before moving to Tokyo, Japan as a DSP-focused marketing manager. Upon her return to the US, she led a nation-wide FAE team supporting AT&T Microelectronics business units / products including wireless baseband and RF technologies, analog modem and digital voice storage, video conferencing, graphics, LAN, mass storage, FPGA, and optoelectronics technologies. Joan then led a nation-wide sales team at Lucent Microelectronics in securing business at strategic Computing OEMs and ODMs, customer premise equipment manufacturers, networking, and remote access server developers.
Joan holds Bachelor of Science degrees in Computer Science and Electrical Engineering from Washington University in St. Louis and a Master of Science degree in Electrical Engineering from Stanford University.