Long-Range Ultra-Low-Power Integrated MEMS Ultrasonic Time‑of‑Flight Range Sensor with Millimeter Accuracy

OVERVIEW

Chirp’s MEMS based ultrasonic technology leverages a Time‑of‑Flight (ToF) range sensor with a power-efficient digital signal processor (DSP) ASIC in a 3.5 × 3.5 mm package. The sensor handles a variety of ultrasonic signal-processing functions and algorithms, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence and proximity sensing, object-detection and avoidance, and position-tracking.

Complementing Chirp’s miniature CH101 ultrasonic ToF sensor product, the CH201 provides accurate range measurements to targets at distances up to 5 meters. Using ultrasonic measurements, the sensor works in any lighting conditions, including full sunlight to complete darkness, and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s wide Field‑of‑View (FoV) can be customized and enables simultaneous range measurements to multiple objects in its FoV.

• Detects objects of any color and optical transparency up to 5m
• Ultra-Low Power
• Works in Any Lighting Condition

• Customizable field of view (FoV) up to 180°
• Integrated 3.5 × 3.5 × 1.26 mm Package
• Low-power SoC firmware for ultrasonic processing a wide-range of usage cases

CH201 Applications

Presence Detection

Smart Locks

Smart Home & IoT

Drones

Ultra-low power and low latency Ultrasonic ToF sensors detect presence and minor motion under any lighting condition

Always-on battery powered smart locks utilize ultra-low power Ultrasonic ToF sensors to enable feature rich smart locks

Compact ultrasonic ToF sensors enable presence detection in any lighting condition

Compact and light weight ultrasonic ToF sensors enable range finding for obstacle avoidance and landing under any environmental condition

CH201 Development Kit

CH201 45° FoV Module

DK-CH201

EV_MOD_CH201-00-01

Comprehensive development platform for CH201, with the ability to connect up to four additional CH201 modules.

Ultrasonic ToF 45° FoV sensor module for rapid prototyping and integration into product enclosures

• DK-CH201 Product Brief
• SonicLink Installer
• AN-000155 – Quick start guide for SonicLink and SmartSonic Development Kit
• AN-000180 – CH101 and CH201 SmartSonic Evaluation Kit User Guide

• AN-000232 – EV_MOD_CH201 User Guide

AH-20166-045045

AH-20100-180180

AH-20129-160040

Symmetrical 45° FoV horn to use with the CH201.

Symmetrical 180° FoV horn to use with the CH201.

Asymmetrical 160° × 40° FoV horn to use with the CH201.

• PB-000084 – AH-20166-045045 Acoustic Housing Brief
• AN-000223 – Acoustic Interface Gluing Procedure for Chirp Ultrasonic Sensing Modules

• PB-000092 – AH-20100-180180 Acoustic Housing Brief
• AN-000223 – Acoustic Interface Gluing Procedure for Chirp Ultrasonic Sensing Modules

• PB-000086 – AH-20129-160040 Acoustic Housing Brief
• AN-000223 – Acoustic Interface Gluing Procedure for Chirp Ultrasonic Sensing Modules