2025年1月7日
TDK株式会社（东京证券交易所代码：6762）重磅推出增强版的新一代InvenSense VibeSense360™解决方案，助力实现跟踪头部动作的高端空间音频体验。目前，该解决方案已开放样品申请，详情可咨询InvenSense销售团队。
VibeSense360™可并行执行多项功能，包括：
VibeSense360™采用InvenSense的超低功耗SmartMotion® IMU，自2023年美国拉斯维加斯消费电子展会 (CES 2023) 首次发布以来，已被客户广泛采用。
“新一代VibeSense360™解决方案可针对TWS应用添加更多UI手势，提高了客户的设计灵活性，并支持在IMU内同时运行包括机器学习在内的多项功能，进一步优化了系统功耗。”TDK集团子公司InvenSense消费与工业运动传感器事业部副总裁兼总经理Pankaj Aggarwal表示，“VibeSense360™正在重新定义TWS市场的高端音频体验标准。”
如需了解更多信息或申请VibeSense360™解决方案的样品，请访问 invensense.tdk.com/tws 或发送电子邮件至 inv.sales.us@tdk.com.
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2024, TDK posted total sales of USD 14.6 billion and employed about 101,000 people worldwide.
InvenSense, a TDK group company, is a world-leading provider of Sensing Solutions. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide.
