Microphone more than doubles Overload Point in latest addition to 70dB SNR Portfolio

  • The ICS-40740 adds to TDK’s 70 dB SNR MEMS microphone family and increases AOP to 133 dB SPL AOP
  • Existing efficient supply chain will support the ICS-40740 to provide high confidence for end customer ramp into volume production for consumer devices


January 9, 2018

TDK Corporation announces an expansion of its ultra-low noise MEMS microphone family with the ICS-40740, delivering 70 dB (A) SNR with 133 dB sound pressure level Acoustic Overload Point. The low self-noise coupled with wide dynamic range makes the ICS-40740 ideal for voice controlled IoT applications, especially those with integrated loudspeakers, as well as wearable applications like noise cancelling headsets.

A microphone’s Signal to Noise Ratio (SNR) has long been recognized as a key specification to enable far-field voice capture. But as the smart speaker market has shown, the capability of these microphones to operate in a very loud environment is also critical to enable the user to interrupt loud audio with spoken commands. The ICS-40740 performs in both demanding respects.

“TDK is pushing the limits of the audio signal chain with the ICS-40740,” said Paul Schreier, InvenSense Senior Director, Audio Marketing. “We are delivering a microphone that can perform audio capture at very great distance with complex beam-forming algorithms while simultaneously capturing high fidelity spoken commands regardless of booming music in close proximity.”

Beyond simple SNR and dynamic range, the ICS-40740 performs across a very wide frequency band, from 80 Hz to 20 kHz. The sensitivity tolerance of ±1 dB also makes it ideal for use in an array with very consistent performance from unit to unit.

Wearable noise-cancelling applications are also a fit for the ICS-40740. With a 4 mm by 3 mm by 1.2 mm package and consuming only 155 uA in operation, the ICS-40740 fits both the size and power budget of a noise-cancelling headset.

The ICS-40740 is sampling now to select customers and is slated for production in the second quarter of 2018. The ICS-40740 leverages a proven, robust supply chain for fabrication, packaging and test for smooth launch into high volume consumer applications.

For additional information about the InvenSense MEMS microphone solutions, please visit www.invensense.tdk.com or contact InvenSense Sales at sales@invensense.com. TDK Corporation and its group companies EPCOS, InvenSense, and TDK-Micronas will be showcasing the ICS-40740 MEMS microphone and additional innovative sensor solutions in Booth 30325, South Hall 3 of the Las Vegas Convention Center at CES® 2018, January 9-12, Las Vegas, Nevada, USA.




  • dB: decibel
  • SPL: Sound Pressure Level
  • MEMS: Micro Electrical Mechanical Systems
  • SNR: Signal to Noise Ratio
  • AOP: Acoustic Overload Point


Key applications

  • ICS-40740:
  • Voice controlled speakers
  • Noise cancelling headsets
  • Teleconferencing
  • Security and surveillance
  • Microphone arrays
  • Voice control and activation


Main features and benefits

  • High SNR ICS-40740 70 dBA
  • High AOP ICS-40740 133 dB SPL
  • 20 kHz bandwidth
  • Very tight tolerances for array processing


Key data

Product Packaging Dimensions (mm) SNR dBA Acoustic Overload Point


Bandwidth kHz Low Frequency Corner Hz
ICS-40740 4.00 × 3.00 × 1.20 70 133 20 80
ICS-40720 4.00 x 3.00 x 1.20 70 124 20 75
ICS-40730 4.72 × 3.76 × 3.50 74 124 20 24





About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s portfolio includes passive components, such as ceramic, aluminum electrolytic and film capacitors, ferrites and inductors, high-frequency products, and piezo and protection components, as well as sensors and sensor systems and power supplies. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK’s further main product groups include magnetic application products, energy devices, and flash memory application devices. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2017, TDK posted total sales of USD 10.5 billion and employed about 100,000 people worldwide.


About InvenSense

InvenSense, Inc., a TDK Group company, is a world leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion and Sound solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. In May of 2017, InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation. InvenSense is headquartered in San Jose, California and has offices worldwide. For more information, go to www.invensense.tdk.com and http://www.coursaretail.com.




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Further information on the products can be found under https://www.invensense.tdk.com/technology/sound/




Contacts for regional media

Region Contact   Phone Mail
Global Mr. David A. ALMOSLINO InvenSense, CA, USA +1 408-501-2278 pr@invensense.com