T5919

T5828

T5837

T5838

T5848

SmartSound One

T3903

T5808

T5818

ICM-52000

ICS-41350

ICS-40212

T4086

ICS-40638

ICS-40800

T4076

ICS-40740

ICS-40214

ICS-40618

ICS-40720

ICS-40730

ICS-40619

ICS-40310

INMP510

T3902

ICS-43434

ICS-41351

ICS-43432

INMP621

INMP521

INMP522

ICS-40300

ICS-40216

ICS-52000

Bottom Port PDM Digital Output Multi-Mode Microphone

The ICS‐52000 is a digital TDM output bottom port microphone. The complete ICS‐52000 solution consists of a MEMS sensor, signal conditioning, an analog‐to‐digital converter, decimation and anti‐aliasing filters, power management, and an industry standard 24‐bit TDM interface. The TDM interface allows an array of up to 16 of the ICS‐52000 microphones to connect directly to digital processors, such as DSPs and microcontrollers, without the need for an audio codec in the system. All microphones in an array sample their acoustic signals synchronously, enabling precise array processing.

The ICS‐52000 has a high SNR of 65 dBA and a wideband frequency response. The sensitivity tolerance of the ICS‐52000 is ±1 dB, which enables high‐performance microphone arrays without the need for system calibration.

The ICS‐52000 is available in a small 4 × 3 × 1 mm surface‐mount package.

ICS-52000

NOT RECOMMENDED FOR NEW DESIGNS


Featured Markets

  • Speech Recognition Arrays
  • Smart Televisions
  • Teleconferencing Systems
  • Gaming Consoles
  • Security Systems
  • Microphone Arrays

Product Details

ProductPackage
Size
OutputPort
Location

SNR
(dBA)
AOP
(dB SPL)
Sensitivity
(dbfs)
LF Cutoff
(Hz)
Status
Purchase

ICS-52000
4 × 3 × 1TDMBottom65116-2650NR/ND
(T5848
recommended)

ICS-52000 Features & Benefits

  • Digital TDM Interface with High Precision 24‐bit Data
  • Supports TDM arrays of up to 16 synchronously-sampled channels
  • High 65 dBA SNR
  • -26 dB FS Sensitivity
  • ±1 dB Sensitivity Tolerance
  • Wide Frequency Response from 50 Hz to 20 kHz
  • Low Current Consumption: 1.0 mA
  • High Power Supply Rejection: -80 dB FS
  • 116 dB SPL Acoustic Overload Point
  • Small 4 × 3 × 1 mm Surface‐Mount Package
  • Compatible with Sn/Pb and Pb‐Free Solder Processes
  • RoHS/WEEE Compliant

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