The purpose of this document is to provide recommendations and guidance on the mechanical integration of Chirp CH101 ultrasonic sensors in device enclosures. This document will cover the mechanical design, geometry, part and assembly tolerances, material considerations, testing, and best practices for mechanical integration. All dimensions mentioned in this document are in mm, unless otherwise specified.
This information in this guide only covers information related specifically to Chirp Microsystems’ CH101 sensors, and not other sensors, such as the CH201. If you are integrating other Chirp Microsystems sensors, please consult the appropriate Mechanical Integration Guide for that product.