AN-000140 – Pressure Sensor PCB Design Guidelines

This document provides high-level placement and layout guidelines for TDK InvenSense pressure sensors. Being a MEMS device, ICP101xx contains mechanical moving parts within the package, and as a result, proper layout is crucial for TDK-InvenSense pressure sensors to ensure the highest performance in a finished product. For a schematic and layout assessment of your design, including placement, please contact TDK InvenSense.

Version 1.6, Updated September 30, 2021

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