Omar Abed joined TDK in November 2020 as the General Manager & Vice President of the Microphone Business Unit. Before joining, he served as General Manager & Vice President for TE Connectivity driving profitable growth for its $300M pressure sensor business. Previously, Omar served as President & CEO for 7 years at Silicon Microstructures (SMI), which was acquired by TE. While at SMI, he led the turnaround of the company by revamping its strategy and driving innovation to become a leading pressure sensor supplier.
Omar was also part of Analog Devices’ Automotive Inertial MEMS team overseeing development and strategy for the passive safety portfolio. Prior, he worked as Design Engineering Lead at Kavlico Corporation developing ultra-low power capacitive pressure sensors.
Omar received a Bachelor of Science degree in Electrical Engineering and Computer Science from UC Berkeley and a Master of Science in Electrical Engineering with an emphasis on Analog and RF Circuit design from University of Southern California. He is an Alumni of Harvard Business School via the PLD program and holds 5 patents for his work on MEMS pressure sensors.
Joseph Bousaba is the General Manager and Vice President of the Motion and Pressure Business unit at TDK. Prior to this role Joseph held the position of General Manager and Vice President of the Emerging Sensors Business Unit at TDK InvenSense and President of TDK Chirp Microsystems since he joined the company. Prior to joining TDK in November of 2019, Joseph was the Vice President of Consumer IoT and Smart Home at Qualcomm where he built and managed a multi-hundred million dollar business from 2014 to 2019. Prior to that from 2012 to 2014, Joseph led the Emerging Business unit and the company’s strategy office at Qualcomm Atheros, where he started and built the IoT and automotive wireless connectivity business and managed the company’s strategic marketing activity. From 2005 to 2012, Joseph served in multiple product marketing and business development leadership roles at Atheros from kickstarting the company’s mobile and consumer connectivity business to serving in strategic marketing and planning roles that contributed to the acquisition of Atheros by Qualcomm. Prior to that, Joseph held multiple engineering and business leadership roles in cellular RF and wireless connectivity at Philips Semiconductors (currently NXP).
Joseph received a M.S. and B.S. degrees in Electrical Engineering from the University of North Carolina at Charlotte.
Pavan Gupta joined TDK InvenSense in December 2021 as the Chief Operating Officer (COO). Prior to joining, Pavan served as a Director of Hardware Engineering at Apple. During his 6 years at Apple, Pavan led the development of Touch and Force sensing technologies on several generations of iPhones and Air Pods. Prior to that, Pavan spent 10 years at SiTime, a leader in MEMS timing space, growing into the role of Vice-President of Operations where he oversaw SiTime’s worldwide fabless manufacturing, logistics and planning, product and test engineering, and quality and reliability. Pavan has also worked at other MEMS-based companies including FormFactor and NanoGear, Inc. (formerly C Speed Corp). He started his career at IBM.
Pavan received his MS from Stanford University and BS from UCLA, both in Mechanical Engineering. He holds 19 patents on topics ranging from MEMS, packaging, haptics, and force sensing.
Dr. Peter G. Hartwell is Chief Technology Officer at InvenSense. Peter has over 25 years’ experience commercializing silicon MEMS products, working on advanced sensors and actuators, and specializes in MEMS testing techniques. At InvenSense Peter is responsible for technology strategy and leads our Advanced Technology research group. Prior to joining InvenSense, Peter spent four years as Architect of Sensing Hardware at Apple where he built and led a team responsible for the integration of accelerometer, gyroscope, magnetometer, pressure, proximity, and ambient light sensors across the entire product line. Before Apple, Peter was a Distinguished Technologist at Hewlett-Packard Laboratories where he spent 12 years. At HP, he was the MEMS lead on HP’s 10 nano-g/rt Hz MEMS accelerometer forming the basis of HP’s Central Nervous System for the Earth (CeNSE), an early version of what has become the Internet of Things (IoT). Peter has over 40 worldwide patents on MEMS devices and sensor applications.
Peter holds a B.S. in Materials Science from the University of Michigan and a Ph. D. in Electrical Engineering from Cornell University.
Joan Huser is the Vice President of Worldwide Sales, MEMS BG at TDK. Joan joined InvenSense, a TDK group company in 2016, and prior to her current role, served as Vice President of Americas and EMEA Sales. Prior to joining InvenSense, Joan spent three years at AMS, leading a team in selling analog sensors, wireless, and power management technologies to strategic consumer, computing and communications OEMs, and ecosystem partners throughout the Americas. For nine years at Broadcom Corporation, Joan led worldwide sales of network infrastructure, wireless connectivity, and broadband communications products to become the top semiconductor supplier to Cisco. Prior to Broadcom, Joan served as Vice President of Business Development and Marketing at W-CDMA semiconductor company MorphICs (acquired by Infineon).
Joan began her career designing Digital Signal Processor chips, development tools, and application software at AT&T Bell Labs, before moving to Tokyo, Japan as a DSP-focused marketing manager. Upon her return to the US, she led a nation-wide FAE team supporting AT&T Microelectronics business units / products including wireless baseband and RF technologies, analog modem and digital voice storage, video conferencing, graphics, LAN, mass storage, FPGA, and optoelectronics technologies. Joan then led a nation-wide sales team at Lucent Microelectronics in securing business at strategic Computing OEMs and ODMs, customer premise equipment manufacturers, networking, and remote access server developers.
Joan holds Bachelor of Science degrees in Computer Science and Electrical Engineering from Washington University in St. Louis and a Master of Science degree in Electrical Engineering from Stanford University.
Eric Kawamoto joined InvenSense in Mar 2015 and serves as Vice President of Operations. Prior to joining InvenSense, Eric held senior leadership positions in Connectivity Product Marketing and Wireless Audio Product & Test Engineering at Microchip, was Vice President and General Manager of the Consumer Electronics Solutions business unit at SMSC and was the CDMA/WCDMA and RF Point Solutions Operations Manager at Motorola SPS, Radio Products Division.
Eric received his BSEE and MSEE degrees in Solid State Device Physics from the University of Hawaii at Manoa, Physical Electronics Laboratory.
Fabio Pasolini is the Vice President and General Manager of the Emerging Sensors Business Unit at TDK InvenSense. Prior to this role Fabio drove Business Development, Ecosystem Development, and Consumer Motion Marketing for InvenSense. Fabio has 25 years of working experience in the MEMS field and prior to joining TDK, began his career at STMicroelectronics (ST) where he contributed to the company’s earliest efforts of MEMS activities. At ST, Fabio held multiple disciplinary roles, including the development of several integrated circuits as Analog and Digital IC Designer, Marketing and Business Development, cumulating into the role of General Manager for the MEMS Product Division a multi-hundreds million dollar business unit at STMicroelectronics.
Fabio holds a Master’s Degree (summa cum laude) in Computer Engineering with specialization in Microelectronics from the University of Pavia, Italy and has been granted 30 patents in the field of stabilization techniques for band-pass sigma-delta converters, low-power readout interfaces, and applications for MEMS based sensors.
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