Amir Panush

CEO of InvenSense, Inc. and General Manager of TDK Corporation’s MEMS Sensors Business Group

Amir Panush joined InvenSense in April 2015 to head the company’s Strategy & Corporate Development where he drove strategic expansion and diversification,  ultimately leading to successful acquisition by TDK. Since the merger completion in 2017 and until 2019 he served as our VP & General Manager of the Motion and Pressure Business Unit, from 2019 to February 2020 as Deputy GM & Chief Operations Officer (COO) of the MEMS Business Group, and now serves as CEO of InvenSense, Inc. and General Manager of TDK Corporation’s MEMS Sensors Business Group. Prior to joining InvenSense, Amir served as Senior Director Product Management and Business development of IoE/IoT Client business at Qualcomm Inc. (NASDAQ: QCOM). Prior to that, he was Director of Automotive Product Management of Qualcomm Atheros division where he grew the business from inception to widespread adoption by tier 1 automotive customers. Prior to Qualcomm, Amir led strategic marketing and partnerships at Atheros Communications (acquired by Qualcomm). His earlier industry roles spanned software engineering and project management leadership at Texas Instruments and Comsys Mobile (acquired by Intel).

Amir holds a Master of Business Administration from Haas Business School, University of California at Berkeley and a bachelor’s degree, Cum Laude, in Computer Science from Technion Institute of Technology in Israel.

Omar Abed

GM & VP – Microphone Business Unit

Omar Abed joined TDK in November 2020 as the General Manager & Vice President of the Microphone Business Unit. Before joining, he served as General Manager & Vice President for TE Connectivity driving profitable growth for its $300M pressure sensor business. Previously, Omar served as President & CEO for 7 years at Silicon Microstructures (SMI), which was acquired by TE. While at SMI, he led the turnaround of the company by revamping its strategy and driving innovation to become a leading pressure sensor supplier.

Omar was also part of Analog Devices’ Automotive Inertial MEMS team overseeing development and strategy for the passive safety portfolio. Prior, he worked as Design Engineering Lead at Kavlico Corporation developing ultra-low power capacitive pressure sensors.

Omar received a Bachelor of Science degree in Electrical Engineering and Computer Science from UC Berkeley and a Master of Science in Electrical Engineering with an emphasis on Analog and RF Circuit design from University of Southern California. He is an Alumni of Harvard Business School via the PLD program and holds 5 patents for his work on MEMS pressure sensors.

Joseph Bousaba

GM & VP – Motion and Pressure Business Unit

Joseph Bousaba is the General Manager and Vice President of the Motion and Pressure Business unit at TDK. Prior to this role Joseph held the position of General Manager and Vice President of the Emerging Sensors Business Unit at TDK InvenSense and President of TDK Chirp Microsystems since he joined the company. Prior to joining TDK in November of 2019, Joseph was the Vice President of Consumer IoT and Smart Home at Qualcomm where he built and managed a multi-hundred million dollar business from 2014 to 2019. Prior to that from 2012 to 2014, Joseph led the Emerging Business unit and the company’s strategy office at Qualcomm Atheros, where he started and built the IoT and automotive wireless connectivity business and managed the company’s strategic marketing activity. From 2005 to 2012, Joseph served in multiple product marketing and business development leadership roles at Atheros from kickstarting the company’s mobile and consumer connectivity business to serving in strategic marketing and planning roles that contributed to the acquisition of Atheros by Qualcomm. Prior to that, Joseph held multiple engineering and business leadership roles in cellular RF and wireless connectivity at Philips Semiconductors (currently NXP).

Joseph received a M.S. and B.S. degrees in Electrical Engineering from the University of North Carolina at Charlotte.

Divi Gupta

GM & VP – Finger Print Business Unit

Divi Gupta joined TDK in April 2016 to lead the company’s Strategic Marketing and R&D in the US and now serves as VP & General Manager of the Fingerprint Business Unit. In the Strategic Marketing and R&D role, Divi led organic and inorganic technology strategy, completing two acquisitions, and built an R&D center. Prior to joining TDK, Divi served as CEO at Newlans, a venture funded startup building tunable RF components, which was bought by TDK in January 2016. Prior to founding Newlans, he was a Sales Engineer and then a Senior Financial Analyst at Narad Networks, a provider of high-speed data connectivity over cable networks, where he ran customer trials and built models of customer deployments respectively.

Divi holds a MBA from The Wharton School, University of Pennsylvania, an MS in Electrical Engineering, and a BS in Electrical Engineering from The University of Massachusetts Amherst.

Peter Hartwell

Chief Technology Officer

Dr. Peter G. Hartwell is Chief Technology Officer at InvenSense. Peter has over 25 years’ experience commercializing silicon MEMS products, working on advanced sensors and actuators, and specializes in MEMS testing techniques. At InvenSense Peter is responsible for technology strategy and leads our Advanced Technology research group. Prior to joining InvenSense, Peter spent four years as Architect of Sensing Hardware at Apple where he built and led a team responsible for the integration of accelerometer, gyroscope, magnetometer, pressure, proximity, and ambient light sensors across the entire product line. Before Apple, Peter was a Distinguished Technologist at Hewlett-Packard Laboratories where he spent 12 years.  At HP, he was the MEMS lead on HP’s 10 nano-g/rt Hz MEMS accelerometer forming the basis of HP’s Central Nervous System for the Earth (CeNSE), an early version of what has become the Internet of Things (IoT). Peter has over 40 worldwide patents on MEMS devices and sensor applications.

Peter holds a B.S. in Materials Science from the University of Michigan and a Ph. D. in Electrical Engineering from Cornell University.

Eric Kawamoto

Vice President – Operations

Eric Kawamoto joined InvenSense in Mar 2015 and serves as Vice President of Operations.  Prior to joining InvenSense, Eric held senior leadership positions in Connectivity Product Marketing and Wireless Audio Product & Test Engineering at Microchip, was Vice President and General Manager of the Consumer Electronics Solutions business unit at SMSC and was the CDMA/WCDMA and RF Point Solutions Operations Manager at Motorola SPS, Radio Products Division.

Eric received his BSEE and MSEE degrees in Solid State Device Physics from the University of Hawaii at Manoa, Physical Electronics Laboratory.

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