SensorStudio Development Tool Used to Ease the Design and Programming of the InvenSense FireFly Platform

SAN JOSE, Calif. & SHANGHAI--(BUSINESS WIRE)--May 10, 2016-- InvenSense, Inc. (NYSE:INVN), a leading provider of MEMS sensor platforms, announced the new SensorStudio 2.1 release and the new ICM-30670 FireFly development kit, a sensor prototyping and development platform for Internet of Things(IoT) and drones applications. The InvenSense IoT development platform is comprised of InvenSense’s ICM-30670 MEMS 6-axis sensor (3-axis gyroscope + 3-axis accelerometer) with an integrated sensor framework software interfacing with an Arduino Zero board. The new ICM-30670 supports up to 1 kHz data rate to the host MCU satisfying the needs for high data throughput applications, such as drones. With SensorStudio and the FireFly development kit, developers are able to select and evaluate the FireFly embedded features (orientation, activity tracking, gestures, etc.), enable quick design and validate embedded features. The new InvenSense development platform simplifies even further, the configuration and extension of the FireFly SensorHub Framework, bringing a unique level of simplification and integration to build smart IoT applications faster.

SensorStudio is a powerful graphical development tool originated by InvenSense to ease the development and programming of sensors and algorithms. SensorStudio provides the environment for extending and customizing FireFly capabilities, supplying standard sensor block functions derived from its sensor framework software. SensorStudio visually assembles elements in a logical way and accesses all the necessary visualizations to fully support the sensor fusion design cycle. SensorStudio allows developers to program and add sensors to the Sensor Framework via a documented set of APIs to control I2C, GPIO, tasks and timers, while masking the complexity of real-time OS. Using simple GUI sensors blocks, SensorStudio can be arranged in elegant flow charts for developers to run and validate their programs, facilitating the rapid prototyping and application development for IoT applications.

The hardware element of the development kit is based on the single-chip InvenSense ICM-30670, the tri-core 6-axis motion tracking solution with integrated framework software serving as a sensor hub that supports the collection and processing of data from internal and external sensors. The integrated InvenSense Sensor Framework provides an open and powerful platform for creating cutting-edge always-on applications, allowing customers to leverage InvenSense sensors and algorithms in order to build their own products.

InvenSense’s new Firefly development kit is compatible with Arduino hardware, GCC-based development tools and Eclipse IDE debugger. InvenSense Studio 2.1 can now interface with other Arduino equivalent IoT platforms, such as Raspberry Pie, ARTIK, etc. by porting InvenSense bridge code to the selected development environment. The development kit includes a fully self-contained sensor software solution with additional memory space available on chip, allowing customers to program with their own logic, creating a platform that is easily scalable and deployable. The InvenSense Sensor Framework keeps on being improved and optimized to bring ever more flexibility, and benefiting from quality levels achieved on large mobile & wearable deployments.

“We have seen an ever growing interest in our customers’ use of SensorStudio as the sensors development platform for IoT applications as well as for other markets,” said Eitan Median, vice president marketing and product management, InvenSense. “SensorStudio and associated development kits, are proving every day our customers can rely on our tools flexibility to develop and productize their own IoT platforms, achieving faster time to market by leveraging InvenSense sensor fusion and our SensorHub framework.”

SensorStudio and the FireFly Development Kit will be available in June for purchase and download on InvenSense’s Developers Corner website. The Studio platform will be exhibited in the InvenSense booth in Hall N1, stand 1742 at the 2016 CES Asia event taking place in Shanghai, China from May 11-13, 2016. To schedule press and partner meetings at the show, contact pr@invensense.com. For additional information on the InvenSense development platform, please visit www.invensense.tdk.com or contact InvenSense Sales at sales@invensense.com.

About InvenSense

InvenSense, Inc. (NYSE:INVN) is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything^™ targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense is headquartered in San Jose, Californiaand has offices worldwide. For more information, go to www.invensense.tdk.com and http://www.coursaretail.com.

©2016 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, FireFly, SensorStudio, TrustedSensor, Coursa, Coursa Sports, Coursa Retail, UltraPrint, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.

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Source: InvenSense, Inc.