InvenSense Inc. Announces Financial Conference Participation For The Fiscal Second Quarter 2017

SAN JOSE, Calif.–(BUSINESS WIRE)–May 24, 2016– InvenSense, Inc. (NYSE: INVN), a leading provider of MEMS sensor platforms, announced that Mark Dentinger, chief financial officer, will participate in three financial conferences during its fiscal first quarter of 2017:

  • The 13th Annual Craig-Hallum Institutional Investor Conference in Minneapolis on Wednesday, June 1st;
  • The Benchmark Company Investor Conference in Milwaukee on Thursday, June 2nd;
  • The Robert W. Baird 2016 Global Consumer, Technology and Services Conference in New York City on June 9th at 7:55 a.m. ET. A webcast of the presentation will be available through the investor relations events portion of the company’s website at

For further information about InvenSense, please visit our website at or contact InvenSense Investor Relations at

About InvenSense

InvenSense, Inc. (NYSE: INVN) is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, and IoT products. InvenSense is headquartered in San Jose, Californiaand has offices worldwide. For more information, go to and

©2016 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, FireFly, SensorStudio, TrustedSensor, Coursa, Coursa Sports, Coursa Retail, UltraPrint, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.

Source: InvenSense, Inc.

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