- ICU-20201 is a high-performance ultrasonic ToF sensor, integrating PMUT (piezoelectric micromachined ultrasonic transducer) with an ultra-low power SoC (system on chip) in a miniature 3.5 x 3.5 mm² reflowable package
- The MEMS sensors provide accurate range measurements at distances up to 5m over a wide and configurable Field-of-View (FoV) on any surface and under any lighting condition
- Due to a powerful embedded processor and extended memory space, the sensors deliver high computational power allowing complete application algorithms directly on the chip
- Provides sensing accuracy required in robotics, drones, smart homes/buildings, and mobile devices
August 31, 2023
TDK Corporation (TSE: 6762) announces the start of full-scale production of its InvenSense SmartSonic™ ICU-20201 ultrasonic Time-of-Flight (ToF) sensor. InvenSense’s SmartSonic™ family of ultrasonic Time-of-Flight (ToF) sensors integrate a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (system on chip) in a miniature reflowable package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 5m, in any lighting condition, including full sunlight, and independently of the target’s color and optical transparency.
This new sensor gives devices the sensitivity required for accurate obstacle avoidance or proximity/presence sensing, used frequently in robotics and drones, or mobile and computing devices for example. It is also highly relevant in settings that require shelf inventory monitoring or level sensing, such as in smart homes or smart buildings.
The ICU-20201 is the latest release in this sensor family that embeds a more powerful on-chip processor with higher computational power. The enhanced processing capabilities allow fitting and running a wide range of application algorithms on-chip, offloading the system MCU completely.
“Thanks to its enhanced capability, ICU-20201 allows the design of smarter and lower power solutions, making the final product greener, safer, and more aware of the surrounding environment,” said Massimo Mascotto, Director of Product Marketing, InvenSense, a TDK Group company. “Its increased computational capability enables smarter product design and an enhanced end user experience for our customers and partners.”
The ICU-20201, in an ultra-compact package footprint of 3.5 x 3.5 mm², is available from multiple distributors worldwide. For additional information or to request a sample, please visit https://invensense.tdk.com/smartsonic or contact InvenSense Sales at firstname.lastname@example.org.
- ToF: Time of Flight
- FoV: Field of View
- EV: Evaluation module
- DK: Developer kit
- MEMS: Micro-electro-mechanical systems
- Presence detection and motion detection for smart door lock
- Proximity/presence sensing for mobile and computing devices
- Obstacle avoidance for robotics and drones
Main features and benefits
- Second generation
- Ultra-low power
- Compact size; miniature ultrasonic sensor
- Wide operating range from 20 cm to 5 m
- Works in any lighting condition
- Detects objects of any color and optical transparency
- Customizable field of view (FoV) up to 180°
- 3.5 mm x 3.5 mm x 1.26 mm, 8-pin LGA package
About TDK Corporation
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK‘s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2023, TDK posted total sales of USD 16.1 billion and employed about 103,000 people worldwide.
InvenSense, a TDK Group company, is a world-leading provider of Sensing Solutions. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide.
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