CH201

Long-Range Ultra-Low-Power Integrated MEMS Ultrasonic Time‑of‑Flight Range Sensor with Millimeter Accuracy

Chirp’s MEMS based ultrasonic technology leverages a Time‑of‑Flight (ToF) range sensor with a power-efficient digital signal processor (DSP) ASIC in a 3.5 × 3.5 mm package. The sensor handles a variety of ultrasonic signal-processing functions and algorithms, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence and proximity sensing, object-detection and avoidance, and position-tracking.

Complementing Chirp’s miniature CH101 ultrasonic ToF sensor product, the CH201 provides accurate range measurements to targets at distances up to 5 meters. Using ultrasonic measurements, the sensor works in any lighting conditions, including full sunlight to complete darkness, and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s wide Field‑of‑View (FoV) can be customized and enables simultaneous range measurements to multiple objects in its FoV.

• Detects objects of any color and optical transparency up to 5m
• Ultra-Low Power
• Works in Any Lighting Condition

• Customizable field of view (FoV) up to 180°
• Integrated 3.5 × 3.5 × 1.26 mm Package
• Low-power SoC firmware for ultrasonic processing a wide-range of usage cases

CH201 Development Kit

CH201 45° FoV Module

DK-CH201

EV_MOD_CH201-00-01

Comprehensive development platform for CH201, with the ability to connect up to four additional CH201 modules.

Ultrasonic ToF 45° FoV sensor module for rapid prototyping and integration into product enclosures

• DK-CH201 Product Brief
• SonicLink Installer [Register for Developers Corner for access]
• AN-000155 – Quick start guide for SonicLink and SmartSonic Development Kit
• AN-000180 – CH101 and CH201 SmartSonic Evaluation Kit User Guide

• AN-000232 – EV_MOD_CH201 User Guide
• EV_MOD_CHx01_Module Design Files