News & Media | TDK InvenSense

TDK announces world’s first MIPI standard SoundWire® microphone

01.08.20 - TDK announces world’s first MIPI standard SoundWire® microphone

New SmartSense™ from TDK wirelessly provides intelligent multi-sensor monitoring and remote data collection for a variety of IoT applications

01.08.20 - New SmartSense™ from TDK wirelessly provides intelligent multi-sensor monitoring and remote data collection for a variety of IoT applications

TDK announces fault tolerant motion sensing product family for industrial applications

01.07.20 - TDK announces fault tolerant motion sensing product family for industrial applications

TDK announces availability of new MEMS-based “sonar on a silicon chip” ultrasonic time-of-flight sensor with extended sensing range

01.07.20 - TDK announces availability of new MEMS-based “sonar on a silicon chip” ultrasonic time-of-flight sensor with extended sensing range

TDK and Qualcomm Technologies drive robotics industry forward with new TDK RoboKit supporting Qualcomm Robotics RB3 Platform and Robot Operating System (ROS)

01.07.20 - TDK and Qualcomm Technologies drive robotics industry forward with new TDK RoboKit supporting Qualcomm Robotics RB3 Platform and Robot Operating System (ROS)

TDK showcases record breadth of solutions for automotive, 5G, IoT, mobile, robotics, wearables and wellness at CES 2020

12.10.19 - TDK showcases record breadth of solutions for automotive, 5G, IoT, mobile, robotics, wearables and wellness at CES 2020

11.14.19 - TDK InvenSense CTO: Tech and Human Touch (eetimes.com)

https://www.eetimes.com/tdk-invensense-cto-tech-and-human-touch/

11.06.19 - MEMS ultrasonic sensor: Pushing the boundaries of AR/VR technology

TDK announces InvenSense CTO as inductee to MSIG hall of fame

10.24.19 - TDK announces InvenSense CTO as inductee to MSIG hall of fame

SmartSonic™ platform family of MEMS-based ultrasonic time-of-flight sensor solutions

10.01.19 - SmartSonic™ platform family of MEMS-based ultrasonic time-of-flight sensor solutions