June 14, 2022
TDK Corporation (TSE:6762) announces the successful integrations of the InvenSense CH201 ultrasonic Time-of-Flight sensors into the Kaadas K9-F 3D Face Push-Pull WiFi smart door lock, enabling its face recognition functionality to automatically unlock for recognized users, which was recently launched into the consumer market.
InvenSense’s SmartSonic™ family of ultrasonic Time-of-Flight (ToF) sensors integrates a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (System on Chip) in a miniature reflowable package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 5m, in any lighting condition, including full sunlight, and independently of the target’s color and optical transparency.
When integrated into a Smart Door Lock system such as the K9-5F 3D Face and K11 face smart lock, the ultrasonic module will allow the system to detect if someone is approaching the door and, if a person is recognized, the facial recognition module will be awakened. The test data shows that the energy consumption of the ultrasonic module combined with the system design experience and intelligent software developed by Kaadas takes up only 10% of the energy of infrared modules, ensuring the long-term battery life of the Kaadas smart lock.
“The continued collaboration with TDK on its ultrasonic Time-of-Flight sensors has led us to adopt them in several of our leading-edge products, allowing us to make them smarter and power efficient,” said Mr. Li Xian, EVP of Kaadas.
“TDK has been recognized multiple times for cutting-edge advancement and achievements that are moving the sensors industry forward,” said Fabio Pasolini, VP and GM at InvenSense, a TDK group company. “We are strongly committed to innovation and will continue to work with Kaadas and other excellent partners in the industry to enrich people’s lives through performance sensing.”
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK‘s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2022, TDK posted total sales of USD 15.6 billion and employed about 117,000 people worldwide.
InvenSense, a TDK Group company, is a world-leading provider of SmartSensing platforms. InvenSense’s vision of Sensing Everything® targets the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. In April of 2022, Chirp Microsystems formally merged with InvenSense. InvenSense is headquartered in San Jose, California and has offices worldwide.
Kaadas is specializing in high-end smart locks, which is a full-industry chain company integrating product development, manufacture, sales, installation and after-sales. It is also a national high-tech enterprise headquartered in Tsinghua Hi-Tech Park, Shenzhen of China. With over 30 years of experience and over 400 international patents in the lock industry, Kaadas is proved to be the most innovative supplier with product driven orientation and large manufacturing capability, capable of providing dealership business and end-to-end OEM/ODM services including industrial design, engineering, production, as well as integration.
You can download this text and associated images at https://invensense.tdk.com/news-media/tdk-extends-battery-life-of-kaadas-smart-door-lock-with-smartsonic-ultra-low-power-time-of-flight-sensors
Further information on the products can be found under https://invensense.tdk.com/products/ch201
